Contract Manufacturing Semiconductors Components

Electronics

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Top: Business: Electronics_and_Electrical: Components: Semiconductors: Contract_Manufacturing:

• Top/Business/Electronics and Electrical/Contract Manufacturing

• - Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Site includes product and technology briefs, and a description of company's manufacturing cleanroom.
  
• - Fabless company aiming to lead the RF GaAs and silicon IC intellectual properties. Leveraging advanced design capabilities, simulation, layout tools to shorten specific RF circuit and system needs.
  
• - Custom RF and microwave (wireless) product development. Requirements definition, analysis, design, prototype build and test.
  
• - Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Site include capabilites, and illustrated discussions of packaging technologies and processes.
  
• - Offering assembly services for plastic IC packaging and full box build contract manufacturing.
  
• - Procuring and processing semiconductor components in wafer, die and packaged form.
  
• - Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
  
• - Fabricates analog and mixed-signal ICs
  
• - Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC.
  
• - Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
  
• - IC packaging and test turnkey solutions with excellent quality, cycle time and pricing.
  
• - Provides wafer foundry, R&D support and specialty wafer fab processing to customers from semiconductors and microelectronic industry; active and passive components, and opto devices. Semconix Corporation.
  
• - Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions
  
• - Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
  
• - Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
  
• - Company offering low NRE one mask architecture and software solutions to the ASIC community. Aimed at FPGA conversion and ASIC replacement markets.
  
• - Providing wafering and polishing services of high performance semiconductors and industrial crystals.
  
• - Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
  
• - Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
  
• - European supplier of advanced semiconductor burn-in and reliability test systems.
  
• - Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
  
• - An ic-design house for consumer, caller id, and related telecom products.
  
• - Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
  
• - Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
  
• - An RF IC design service offering solutions for analog RF and mixed-signal projects from draft to production.
  
• - Engineering, production test and backend manufacturing management services for semiconductor manufacturers and designers.
  
• - Custom thin film deposition and thin film device fabrication.
  
• - Dedicated integrated circuit (IC) wafer foundry
  
• - Provider of subcontract scribe dicing of semiconductor wafers.
  
• - Offers custom layout and fabrication services for emerging companies and university groups.
  
• - Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
  
• - Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
  
• - Provides semiconductor IC assembly and testing services.
  
• - A fabless design house focused on RF and high-speed digital integrated designs.
  
• - Semiconductor test and assembly provider servicing wafer foundries, integrated device manufacturers and fabless semiconductor companies worldwide.
  
• - An independent subcontractor for semiconductor assembly, test and packaging services.
  
• - A 6" discrete wafer foundry, specializing in Schottky, SF, TVS and Thyristor wafer.
  
• - Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto.
  
• - Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
  
• - A contract design source for IC layout utilizing automated design.
  
• - Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment.
  
• - Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
  
• - Offers turnkey contract manufacturing, logistics and testing services.
  
• - Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
  
• - Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
  
• - Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
  
• - Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.